Griem, Hans R.  | Cambridge Univ Pr

136,980원  | 20050228  | 9780521619417

A comprehensive description of the theoretical foundations and experimental applications of spectroscopic methods in plasmas.

H. Hutchinson  | Cambridge

0원  | 99991230  | 9780521385831

 | Kluwer

265,810원  | 20021201  | 9780306474972

Plasma processing of semiconductors is an interdisciplinary field requiring knowledge of both plasma physics and chemical engineering. The two authors are experts in each of these fields, and their collaboration results in the merging of these fields with a common terminology. Basic plasma concepts are introduced painlessly to those who have studied undergraduate electromagnetics but have had no previous exposure to plasmas. Unnecessarily detailed derivations are omitted; yet the reader is led to understand in some depth those concepts, such as the structure of sheaths, that are important in the design and operation of plasma processing reactors. Physicists not accustomed to low-temperature plasmas are introduced to chemical kinetics, surface science, and molecular spectroscopy. The material has been condensed to suit a nine-week graduate course, but it is sufficient to bring the reader up to date on current problems such as copper interconnects, low-k and high-k dielectrics, and oxide damage. Students will appreciate the web-style layout with ample color illustrations opposite the text, with ample room for notes. The included CD contains a copy of the book which can be indexed using a Search function, and which can be enlarged on a monitor for a closer look at the diagrams. Sample homework and exam problems can also be found on the CD. This short book is ideal for new workers in the semiconductor industry who want to be brought up to speed with minimum effort. It is also suitable for Chemical Engineering students studying plasma processing of materials; Engineers, physicists, and technicians entering the semiconductor industry who want a quick overview of the use of plasmas in the industry.

Umran S Inan, Marek Golkowski  | Cambridge

80,000원  | 20190701  | 9780521193726

This unified introduction provides the tools and techniques needed to analyze plasmas and connects plasma phenomena to other fields of study. Combining mathematical rigor with qualitative explanations, and linking theory to practice with example problems, this is a perfect textbook for senior undergraduate and graduate students taking one-semester introductory plasma physics courses. For the first time, material is presented in the context of unifying principles, illustrated using organizational charts, and structured in a successive progression from single particle motion, to kinetic theory and average values, through to collective phenomena of waves in plasma. This provides students with a stronger understanding of the topics covered, their interconnections, and when different types of plasma models are applicable. Furthermore, mathematical derivations are rigorous, yet concise, so physical understanding is not lost in lengthy mathematical treatments. Worked examples illustrate practical applications of theory and students can test their new knowledge with 90 end-of-chapter problems.

 | Wiley

272,120원  | 20050401  | 9780471720010

A Thorough Update of the Industry Classic on Principles of Plasma Processing The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals. The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in-depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters. New and expanded topics include: * Updated cross sections * Diffusion and diffusion solutions * Generalized Bohm criteria * Expanded treatment of dc sheaths * Langmuir probes in time-varying fields * Electronegative discharges * Pulsed power discharges * Dual frequency discharges * High-density rf sheaths and ion energy distributions * Hysteresis and instabilities * Helicon discharges * Hollow cathode discharges * Ionized physical vapor deposition * Differential substrate charging With new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever.